Scalable Manufacturing of Liquid Metal Circuits
نویسندگان
چکیده
Liquid-metal (LM)-based soft and stretchable electronics (SSEs) provide unique advantages for wearable computing, robotics, implantable devices applications involving physical interaction with biological tissues delicate objects. However, the lack of scalable manufacturing techniques prevents their mainstream adoption commercialization. This paper introduces a reproducible technique wafer-level fabrication LM-based SSEs, including LM-only hybrid circuits LM solid-state microelectronics. The approach combines selective metal-alloy wetting (SMAW) controlled dip-coating eutectic gallium-indium (EGaIn). alloying EGaIn metal enables depositing selectively onto circuit layout defined by lithographically patterned copper traces on elastomer-coated wafers. An automated, (DC) is developed to enable controllable deposition EGaIn. Wafer-level simultaneous many capacitors demonstrated, geometric electrical reproducibility evaluated. results indicate that SMAW-DC process can fabricate reproducibly rapidly. Hybrid SSEs are demonstrated fabricating multiple patches ultra-high frequency an dipole antenna, strain gauge, temperature sensor. Importantly, presented be integrated into standard microfabrication flow microelectronics, ensuring high level scalability.
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ژورنال
عنوان ژورنال: Advanced materials and technologies
سال: 2022
ISSN: ['2365-709X']
DOI: https://doi.org/10.1002/admt.202200295